INTERCONNECT NOISE OPTIMIZATION IN NANOMETER TECHNOLOGIES
MAGDY A. BAYOUMI
Sold by Basi6 International, Irving, TX, U.S.A.
AbeBooks Seller since June 24, 2016
New - Hardcover
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Add to basketSold by Basi6 International, Irving, TX, U.S.A.
AbeBooks Seller since June 24, 2016
Condition: New
Quantity: 1 available
Add to basketNew. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Interconnect has become the dominating factor in determining system performance in nanometer technologies. Dedicated to this subject, Interconnect Noise Optimization in Nanometer Technologies provides insight and intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits.
The authors bring together a wealth of information presenting a range of CAD algorithms and techniques for synthesizing and optimizing interconnect. Practical aspects of the algorithms and the models are explained with sufficient details. The book investigates the most effective parameters in layout optimization. Different post-layout optimization techniques with complexity analysis and benchmarks tests are provided. The impact crosstalk noise and coupling on the wire delay is analyzed. Parameters that affect signal integrity are also considered.
Interconnect has become the dominating factor in determining system performance in nanometer technologies. Dedicated to this subject, Interconnect Noise Optimization in Nanometer Technologies provides insight and intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits.
The authors bring together a wealth of information presenting a range of CAD algorithms and techniques for synthesizing and optimizing interconnect. Practical aspects of the algorithms and the models are explained with sufficient details. The book investigates the most effective parameters in layout optimization. Different post-layout optimization techniques with complexity analysis and benchmarks tests are provided. The impact crosstalk noise and coupling on the wire delay is analyzed. Parameters that affect signal integrity are also considered.
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