IUTAM Symposium on Multiscale Modeling and Characterization of Elastic-Inelastic Behavior of Engineering Materials

S. Ahzi

ISBN 10: 9048165296 / ISBN 13: 9789048165292

Published by Springer Netherlands, Springer Netherlands Dez 2010, 2010

About this Item

This item is printed on demand - Print on Demand Titel. Neuware -The papers in this proceeding are a collection of the works presented at the IUTAM symposium-Marrakech 2002 (October 20-25) which brought together scientists from various countries. These papers cover contemporary topics in multiscale modeling and characterization of materials behavior of engineering materials. They were selected to focus on topics related to deformation and failure in metals, alloys, intermetallics and polymers including: experimental techniques, deformation and failure mechanisms, dislocation-based modelling, microscopic-macroscopic averaging schemes, application to forming processes and to phase transformation, localization and failure phenomena, and computational advances. Key areas that are covered by some of the papers include modeling of material deformation at various scales. At the atomistic scale, results from MD simulations pertaining to deformation mechanisms in nano-crystalline materials as well as dislocation-defect interactions are presented. Advances in modeling of deformation in metals using discrete dislocation analyses are also presented, providing an insight into this emerging scientific technique that can be used to model deformation at the microscale. These papers address current engineering problems, including deformation of thin fIlms, dislocation behavior and strength during nanoindentation, strength in metal matrix composites, dislocation-crack interaction, development of textures in polycrystals, and problems involving twining and shape memory behavior. On Behalf of the organizing committee, I would like to thank Professor P.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 452 pp. Englisch.

Seller Inventory # 9789048165292

Bibliographic Details

• Title: IUTAM Symposium on Multiscale Modeling and Characterization of Elastic-Inelastic Behavior of Engineering Materials
• Publisher: Springer Netherlands, Springer Netherlands Dez 2010
• Publication Date: 2010
• Language: English
• ISBN 10: 9048165296
• ISBN 13: 9789048165292
• Binding: Taschenbuch
• Condition: Neu
• Dimensions: 244W x 170H x 25D millimeters 244 millimeters width by 170 millimeters height by 25 millimeters depth
• Weight: 774 grams

About this title

Synopsis

The papers in this proceeding are a collection of the works presented at the IUTAM symposium-Marrakech 2002 (October 20-25) which brought together scientists from various countries. These papers cover contemporary topics in multiscale modeling and characterization of materials behavior of engineering materials. They were selected to focus on topics related to deformation and failure in metals, alloys, intermetallics and polymers including: experimental techniques, deformation and failure mechanisms, dislocation-based modelling, microscopic-macroscopic averaging schemes, application to forming processes and to phase transformation, localization and failure phenomena, and computational advances. Key areas that are covered by some of the papers include modeling of material deformation at various scales. At the atomistic scale, results from MD simulations pertaining to deformation mechanisms in nano-crystalline materials as well as dislocation-defect interactions are presented. Advances in modeling of deformation in metals using discrete dislocation analyses are also presented, providing an insight into this emerging scientific technique that can be used to model deformation at the microscale. These papers address current engineering problems, including deformation of thin fIlms, dislocation behavior and strength during nanoindentation, strength in metal matrix composites, dislocation-crack interaction, development of textures in polycrystals, and problems involving twining and shape memory behavior. On Behalf of the organizing committee, I would like to thank Professor P.