Paperback. Pub Date: 2017-03-01 Pages: $number Language: Chinese Publisher: Science Press. Journal of Information Science and technology: integrated circuit three-dimensional system integration and encapsulation Technology (Chinese Guide) system discussion for electronic. 2 of optoelectronic and MEMS devices. 5D. 3D. and 3D IC integration and packaging technology .

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Bibliographic Details

Title: Information Science and Technology academic Works series: integrated circuit three-dimensional system integration and packaging Technology (Chinese guide)(Chinese Edition)
Publisher: Science Press
Language: Chinese
ISBN 10: 7030522729
ISBN 13: 9787030522726
Binding: paperback
Condition: New

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NAN JING SHI JIANG NING QU NING YUAN DIAN ZI SHANG WU ZHONG XIN
Room 264, Oujiang Shopping Center, No. 1 Dongxin South Road, Dongshan Street, Jiangning District, NanJing, Nanjing, JS, 211100, China

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