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This book brings together the research papers presented at the 5th International Conference on Smart Technologies and Systems (CI3 2024). The conference was organized by the Red de Investigación, Innovación y Transferencia Tecnológica (RIT2), made up of the most relevant university institutes in Ecuador, including: AMERICAN COLLEGE, ARGOS, BOLIVARIANO, CENTRAL TÉCNICO, CORDILLERA, ESPÍRITU SANTO, ISMAC, ITCA, HUMANE, ORIENTE, POLICIA NACIONAL, RUMIÑAHUI, SAN ISIDRO, SUCRE, SUDAMERICANO, TECNOLÓGICO DEL AZUAY and VIDA NUEVA. Additionally, it was sponsored by the Secretaría de Educación Superior, Ciencia, Tecnología e Innovación (SENESCYT), the Corporación Ecuatoriana para el Desarrollo de la Investigación y la Academia (CEDIA), the Laboratório de Comunicações Visuais of Campinas University (Brazil), Ana G. Méndez University (Puerto Rico), the Centro de Investigaciones Psicopedagógicas y Sociológicas (Cuba) and the Instituto Superior de Diseño de la Universidad de La Habana (Cuba).
From the Back Cover:
This book brings together the research papers presented at the 5th International Conference on Smart Technologies and Systems (CI3 2024). The conference was organized by the Red de Investigación, Innovación y Transferencia Tecnológica (RIT2), made up of the most relevant university institutes in Ecuador, including: AMERICAN COLLEGE, ARGOS, BOLIVARIANO, CENTRAL TÉCNICO, CORDILLERA, ESPÍRITU SANTO, ISMAC, ITCA, HUMANE, ORIENTE, POLICIA NACIONAL, RUMIÑAHUI, SAN ISIDRO, SUCRE, SUDAMERICANO, TECNOLÓGICO DEL AZUAY and VIDA NUEVA. Additionally, it was sponsored by the Secretaría de Educación Superior, Ciencia, Tecnología e Innovación (SENESCYT), the Corporación Ecuatoriana para el Desarrollo de la Investigación y la Academia (CEDIA), the Laboratório de Comunicações Visuais of Campinas University (Brazil), Ana G. Méndez University (Puerto Rico), the Centro de Investigaciones Psicopedagógicas y Sociológicas (Cuba) and the Instituto Superior de Diseño de la Universidad de La Habana (Cuba).
Title: Innovation and Research ? Smart Technologies...
Publisher: Springer
Publication Date: 2025
Binding: Soft cover
Condition: New