Innovative Processes and Materials in Additive Manufacturing
Language: English
Published by Woodhead Publishing, 2022
- Softcover
- Used

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- Title
- Innovative Processes and Materials in Additive Manufacturing
- Author
- Singh, Sunpreet (EDT); Prakash, Chander (EDT); Ramakrishna, Seeram (EDT)
- Publisher
- Woodhead Publishing
- Publication year
- 2022
- Condition
- As New
- Binding
- Soft cover
- Language
- English
- ISBN 10
- 0323860117
- ISBN 13
- 9780323860116
Innovative Processes and Materials in Additive Manufacturing explains game-changing interdisciplinary applications of recent research breakthroughs in additive manufacturing technology. The number of research publications addressing additive manufacturing has soared in recent years as a range of disciplines explore the possibilities that this technology can provide. This book acts as a bridge between this high-level research and the large number of academics and practitioners looking to additive manufacturing for innovative solutions, providing them with practical and approachable information. Applications in aerospace, automotive, medical, construction, and food industries are addressed, featuring technical details that will help successful implementation.
This unique book also provides broad coverage of the theory behind this emerging technology, including material development, as well as the technical details required for readers to investigate the novel applications of the involved methods for themselves.
- Includes case studies from the aerospace, construction and medical industries
- Features innovations in the integration of additive manufacturing processes with other manufacturing technologies
- Identifies exciting routes for future research and application areas of additive manufacturing
"Synopsis" may belong to another edition of this title.
About the Author
Prof. Chander Prakash is working as Pro-Vice Chancellor research, ranking, and accreditation at Geeta University, Haryana, India and he is also associated Project Head at Research Laboratory of 3D Bioprinting Technologies for Flexible Electronics, Institute of Nanotechnology, Electronic and Equipment Engineering, Southern Federal University, Taganrog, Russia. He is a passionate researcher with diversified research interests―developing materials for biomedical and healthcare applications, additive manufacturing, and developing and exploring new cost- effective manufacturing technologies for biomedical industries. To date, he has published more than 530 scientific articles in various peer-reviewed, reputed top-notch journals, conferences, and books in Materials Science and Manufacturing. He is a Highly Cited Researcher at the international level, and he has 18000+ citations, an H-index of 73, and an i-10 index is 306 (as of January 2026). He edited/authored 40 books, serving as Series Editor of 3 books, Editorial Board Member of journals. He is among India’s Top 1% of leading mechanical and aerospace engineering scientists, as per Research.com. He holds the 38th rank in India and 1,590th rank in the world. He also consistently appeared in the top 2% of researchers as per Stanford Study in 2021, 2022, 2023, and 2024.
Seeram Ramakrishna is the Director of the Center for Nanofibres and Nanotechnology at the National University of Singapore (NUS), which is ranked among the top 20 universities in the world. He is regarded as the modern father of electrospinning. He is an elected Fellow of UK Royal Academy of Engineering (FREng); Singapore Academy of Engineering; Indian National Academy of Engineering; and ASEAN Academy of Engineering & Technology. He is an elected Fellow of the International Union of Societies of Biomaterials Science and Engineering (FBSE); Institution of Engineers Singapore; ISTE, India; Institution of Mechanical Engineers and Institute of Materials, Minerals & Mining, UK; and American Association of the Advancement of Science; ASM International; American Society for Mechanical Engineers; American Institute for Medical & Biological Engineering, USA. He is an editor of Elsevier journal Current Opinion in Biomedical Engineering.
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