Integrated Circuit

Language: English

Published by John Wiley & Sons Mär 1994, 1994

0471594466 / 9780471594468

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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Item description from seller

Neuware - Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: - Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost - Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data - Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures - Characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved - Use experiment, step-stress, and accelerated methods to ensure optimum design before production begins Detailed design guidelines for substrate.wire and wire, tape automated, and flip-chip bonding.element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate.wire and wire, tape automated, and flip-chip bonding.element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage.…

Seller Inventory # 9780471594468

Title
Integrated Circuit
Author
Pecht
Publisher
John Wiley & Sons Mär 1994
Publication year
1994
Condition
Neu
Binding
Buch
Language
English
ISBN 10
0471594466
ISBN 13
9780471594468
Item weight
859 grams
Dimensions
240x161x29 mm

AHA-BUCH GmbH

Einbeck, Germany

5-star seller

AbeBooks seller since August 14, 2006

Shipping rates from Germany to U.S.A.

Item7 to 10 business days5 to 7 business days
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