Neuware - Examines various aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This work discusses: circuit design technology trends; sources of error in wafer fabrication and assembly; avenues of contamination; IC packaging methods; and, in-line process monitors and test structures.

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Bibliographic Details

Title: Integrated Circuit Quality and Reliability
Publisher: Taylor & Francis Inc Dez 1994
Publication Date: 1994
Language: English
ISBN 10: 0824792831
ISBN 13: 9780824792831
Binding: Buch
Edition: 2nd Edition
Condition: Neu
Dimensions: 239 millimeters width by 165 millimeters height by 42 millimeters depth
Weight: 1288 grams

About this title

Synopsis

Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.

About the Author

Hnatek, Eugene R.

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