Interconnect Noise Optimization in Nanometer Technologies

Elgamel Mohamed Bayoumi Magdy

ISBN 10: 1441938443 / ISBN 13: 9781441938442

Published by Springer, 2010

About this Item

Print on Demand pp. 160 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.

Seller Inventory # 5838797

Bibliographic Details

• Title: Interconnect Noise Optimization in Nanometer Technologies
• Publisher: Springer
• Publication Date: 2010
• Language: English
• ISBN 10: 1441938443
• ISBN 13: 9781441938442
• Binding: Soft cover
• Condition: New

About this title

Synopsis

This book provides insight into the use of CAD for layout analysis and optimization of interconnect in high speed, high complexity integrated circuits, which have become the dominating factor in determining system performance in nanometer technologies. The text investigates the effects on system performance and reliability of wire size, spacing, wire length, coupling length, load capacitance, rise time of the inputs, place of overlap, frequency, shields, signal direction and wire width for both the aggressors and the victim wires. The authors present a range of CAD algorithms and techniques for synthesizing and optimizing interconnect.

From the Back Cover

Interconnect has become the dominating factor in determining system performance in nanometer technologies. Dedicated to this subject, Interconnect Noise Optimization in Nanometer Technologies provides insight and intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits.

The authors bring together a wealth of information presenting a range of CAD algorithms and techniques for synthesizing and optimizing interconnect. Practical aspects of the algorithms and the models are explained with sufficient details. The book investigates the most effective parameters in layout optimization. Different post-layout optimization techniques with complexity analysis and benchmarks tests are provided. The impact crosstalk noise and coupling on the wire delay is analyzed. Parameters that affect signal integrity are also considered.