Interconnect Reliability in Advanced Memory Device Packaging

Language: English

Published by Springer International Publishing, 2024

3031267109 / 9783031267109

Series: Book 86 of 90 - Springer Series in Reliability Engineering

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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Softcover

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Druck auf Anfrage Neuware - Printed after ordering - This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.…

Seller Inventory # 9783031267109

Title
Interconnect Reliability in Advanced Memory Device Packaging
Author
Chen-Yu Huang
Publisher
Springer International Publishing
Publication year
2024
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
3031267109
ISBN 13
9783031267109
Item weight
394 grams
Dimensions
235x155x12 mm
Series
Book 86 of 90: Springer Series in Reliability Engineering

AHA-BUCH GmbH

Einbeck, Germany

5-star seller

AbeBooks seller since August 14, 2006

Shipping rates from Germany to U.S.A.

Item30 to 40 business days7 to 14 business days
First itemUS$ 69.73US$ 80.98
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