Interconnect Reliability in Advanced Memory Device Packaging

Language: English

Published by Springer, Berlin|Springer International Publishing|Springer, 2024

3031267109 / 9783031267109

Series: Book 86 of 90 - Springer Series in Reliability Engineering

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Seller: moluna, Greven, Germanymoluna

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Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the rel.

Seller Inventory # 1602275932

Title
Interconnect Reliability in Advanced Memory Device Packaging
Author
Gan, Chong Leong,|Huang, Chen-Yu,
Publisher
Springer, Berlin|Springer International Publishing|Springer
Publication year
2024
Condition
New
Binding
Soft cover
Language
English
ISBN 10
3031267109
ISBN 13
9783031267109
Series
Book 86 of 90: Springer Series in Reliability Engineering

moluna

Greven, Germany

5-star seller

AbeBooks seller since July 9, 2020

Shipping rates from Germany to U.S.A.

Item26 to 60 business days26 to 60 business days
First itemUS$ 55.13US$ 55.13
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