Interconnect Technology and Design for Gigascale Integration

. Ed(s): Davis, Jeffrey A. (College of Computing, Georgia Institute of Technology, Atlanta, USA); Meindl, James D.

ISBN 10: 1402076061 / ISBN 13: 9781402076060

Published by Kluwer Academic Publishers, 2003

About this Item

Includes topics ranging from IBM's revolutionary copper process to an exploration into interconnect-aware computer architectures. Editor(s): Davis, Jeffrey A. (College of Computing, Georgia Institute of Technology, Atlanta, USA); Meindl, James D. Num Pages: 411 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 23. Weight in Grams: 779. . 2003. Hardback. . . . .

Seller Inventory # V9781402076060

Bibliographic Details

• Title: Interconnect Technology and Design for Gigascale Integration
• Publisher: Kluwer Academic Publishers
• Publication Date: 2003
• Language: English
• ISBN 10: 1402076061
• ISBN 13: 9781402076060
• Binding: Hardcover
• Condition: New

About this title

Synopsis

Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications of the semiconductor industry's next substantial milestone - gigascale integration.