Interfaces Crystallization Viscoelasticity

A. Budkowski

ISBN 10: 3662156296 / ISBN 13: 9783662156292

Published by Springer Berlin Heidelberg, Springer Berlin Heidelberg, 2013

About this Item

Druck auf Anfrage Neuware - Printed after ordering - Epoxy resins are regarded as thermosetting resins and have found various c- mercial applications after crosslinking with adequate curing agents [1-3]. H- ever, some epoxy resins have been used as thermoplastic resins without curing agents. Figure 1 shows the applications of epoxy resins that are classi ed to three categories: thermosets in combination with curing agents, thermoplastics wi- out curing agents, and raw materials for modi cation. The use in thermoplastics is not popular compared with the two other applications. Typical thermoplastic applications are found in stabilizers for vinyl resins, toners for copying - chines, re retardants for engineering plastics, and sizing material for glass or carbon bers. The epoxy resin most frequently used is the oligomer of the diglycidyl ether of bisphenol-A (DGEBA) whose chemical structure is shown below [1-3]. The DGEBA is composed of linear molecules with different molecular weights according to the variation of the repeated number (n) in the structural formula.

Seller Inventory # 9783662156292

Bibliographic Details

• Title: Interfaces Crystallization Viscoelasticity
• Publisher: Springer Berlin Heidelberg, Springer Berlin Heidelberg
• Publication Date: 2013
• Language: English
• ISBN 10: 3662156296
• ISBN 13: 9783662156292
• Binding: Taschenbuch
• Condition: Neu
• Dimensions: 235W x 155H x 12D millimeters 235 millimeters width by 155 millimeters height by 12 millimeters depth
• Weight: 335 grams

About this title

Synopsis

Epoxy resins are regarded as thermosetting resins and have found various c- mercial applications after crosslinking with adequate curing agents [1–3]. H- ever, some epoxy resins have been used as thermoplastic resins without curing agents. Figure 1 shows the applications of epoxy resins that are classi?ed to three categories: thermosets in combination with curing agents, thermoplastics wi- out curing agents, and raw materials for modi?cation. The use in thermoplastics is not popular compared with the two other applications. Typical thermoplastic applications are found in stabilizers for vinyl resins, toners for copying - chines, ?re retardants for engineering plastics, and sizing material for glass or carbon ?bers. The epoxy resin most frequently used is the oligomer of the diglycidyl ether of bisphenol-A (DGEBA) whose chemical structure is shown below [1–3]. The DGEBA is composed of linear molecules with different molecular weights according to the variation of the repeated number (n) in the structural formula.