Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Pub Date :2013-09-01 Pages: 224 Publisher: Machinery Industry Press at the end of the first decade of the 21st century . based on 3D integration technology. More than Moore era quietly arrived. Have multiple active devices planes 3D IC (3DIC). is expected to provide a compact. flexible cabling . transmission speed and the number of multi- channel interconnect structures . thus providing breakthrough interconnect bottleneck for the effective IC designers means . but also to the effective integ.Four Satisfaction guaranteed,or money back.

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Bibliographic Details

Title: International Mechanical Engineering Advanced Technology Renditions : 3D IC design(Chinese Edition)
Publisher: Machinery Industry Press
Publication Date: 2013
Language: Chinese
ISBN 10: 7111433513
ISBN 13: 9787111433514
Binding: paperback
Condition: New

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Industry Date :2013-09-01 224 Machinery Industry Press at the end of the first decade of the 21st century . based on 3D integration technology. More than Moore era quietly arrived. Have multiple active devices planes 3D IC (3DIC). is...

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