Introduction to Microelectronic Fabrication (Modular Series on Solid State Devices, Vol 5)

Jaeger, Richard C.

ISBN 10: 0201146959 / ISBN 13: 9780201146950

Published by Addison-Wesley, 1988

About this Item

COVER SHOWS GENERAL WEAR, SUCH AS SCRATCHES, RUBBING, STAINING, STICKER AND/OR GLUE RESIDUE AND CREASES. BOOK HAS SOME HIGHLIGHTING AND/OR UNDERLINING OF TEXT. paperback 100% of proceeds go to charity! Acceptable reading copy with obvious signs of use, wear, and/or cosmetic issues. Item is complete and remains readable despite notable condition issues.

Seller Inventory # U-06-4608

Bibliographic Details

• Title: Introduction to Microelectronic Fabrication (Modular Series on Solid State Devices, Vol 5)
• Publisher: Addison-Wesley
• Publication Date: 1988
• Language: English
• ISBN 10: 0201146959
• ISBN 13: 9780201146950
• Binding: Soft cover
• Condition: Acceptable

About this title

Synopsis

This introductory book assumes minimal knowledge of the existence of integrated circuits and of the terminal behavior of electronic components such as resistors, diodes, and MOS and bipolar transistors. It presents to readers the basic information necessary for more advanced processing and design books. Focuses mainly on the basic processes used in fabrication, including lithography, oxidation, diffusion, ion implementation, and thin film deposition. Covers interconnection technology, packaging, and yield. Appropriate for readers interested in the area of fabrication of solid state devices and integrated circuits.

From the Back Cover

Introduction to Microelectronic Fabrication, Second Edition, by Richard C. Jaeger, is a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing and is highlighted by careful explanations, clean, simple language, and numerous fully solved example problems.

The second edition includes an entirely new chapter on MEMS, as well as substantial modifications to the chapters on MOS and bipolar process integration. Also included is new or expanded coverage of lithography and exposure systems, trench isolation, chemical mechanical polishing, shallow junctions, transient enhanced diffusion, copper Damascene processes and process simulation.