Introduction to Microelectronic Fabrication (Modular Series on Solid State Devices, Vol 5)
Language: English
Published by Addison-Wesley, 1988
- Softcover
- Used

Seller: Dream Books Co., Denver, CO, U.S.A.Dream Books Co.
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Condition: Used - Good
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Gently used with minimal wear on the corners and cover. A few pages may contain light highlighting or writing, but the text remains fully legible. Dust jacket may be missing, and supplemental materials like CDs or codes may not be included. May be ex-library with library markings. Ships promptly.
Seller Inventory # DBV.0201146959.G
- Title
- Introduction to Microelectronic Fabrication (Modular Series on Solid State Devices, Vol 5)
- Author
- Jaeger, Richard C.
- Publisher
- Addison-Wesley
- Publication year
- 1988
- Condition
- good
- Binding
- Soft cover
- Language
- English
- ISBN 10
- 0201146959
- ISBN 13
- 9780201146950
This introductory book assumes minimal knowledge of the existence of integrated circuits and of the terminal behavior of electronic components such as resistors, diodes, and MOS and bipolar transistors. It presents to readers the basic information necessary for more advanced processing and design books. Focuses mainly on the basic processes used in fabrication, including lithography, oxidation, diffusion, ion implementation, and thin film deposition. Covers interconnection technology, packaging, and yield. Appropriate for readers interested in the area of fabrication of solid state devices and integrated circuits.
"Synopsis" may belong to another edition of this title.
From the Back Cover
Introduction to Microelectronic Fabrication, Second Edition, by Richard C. Jaeger, is a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing and is highlighted by careful explanations, clean, simple language, and numerous fully solved example problems.
The second edition includes an entirely new chapter on MEMS, as well as substantial modifications to the chapters on MOS and bipolar process integration. Also included is new or expanded coverage of lithography and exposure systems, trench isolation, chemical mechanical polishing, shallow junctions, transient enhanced diffusion, copper Damascene processes and process simulation.
"About the title" may belong to another edition of this title.
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