Introduction to Microelectronic Fabrication V.

Richard C. Jaeger

ISBN 10: 0201444941 / ISBN 13: 9780201444940

Published by Pearson, 2002

About this Item

For courses in Theory and Fabrication of Integrated Circuits. The author's goal in writing this text was to present a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing, and is highlighted by careful explanations, clear, simple language, and numerous fully-solved example problems. This work assumes a minimal knowledge of integrated circuits and of terminal behavior of electronic components such as resistors, diodes, and MOS and bipolar transistors.

Seller Inventory # 24ceeda6-9083-483b-8066-c6896bf086c9

Bibliographic Details

• Title: Introduction to Microelectronic Fabrication V.
• Publisher: Pearson
• Publication Date: 2002
• Language: English
• ISBN 10: 0201444941
• ISBN 13: 9780201444940
• Binding: Softcover
• Edition: 2nd Edition
• Condition: Fine

About this title

Synopsis

For courses in Theory and Fabrication of Integrated Circuits.

The author's goal in writing this text was to present a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing, and is highlighted by careful explanations, clear, simple language, and numerous fully-solved example problems. This work assumes a minimal knowledge of integrated circuits and of terminal behavior of electronic components such as resistors, diodes, and MOS and bipolar transistors.

From the Back Cover

Introduction to Microelectronic Fabrication, Second Edition, by Richard C. Jaeger, is a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing and is highlighted by careful explanations, clean, simple language, and numerous fully solved example problems.

The second edition includes an entirely new chapter on MEMS, as well as substantial modifications to the chapters on MOS and bipolar process integration. Also included is new or expanded coverage of lithography and exposure systems, trench isolation, chemical mechanical polishing, shallow junctions, transient enhanced diffusion, copper Damascene processes and process simulation.