Jin, Y: Introduction to Microsystem Packaging Technology

Language: English

Published by CRC Press, 2018

1138374253 / 9781138374256

  • Softcover
  • New
See all details

Seller: moluna, Greven, Germanymoluna

5-star seller

AbeBooks seller since July 9, 2020

View this seller's items
Softcover

Condition: New

US$ 108.99

US$ 56.83 shipping 
Ships from Germany to U.S.A.

Quantity: Over 20 available

Add to basket
Free 30-day returns

Item description from seller

Dr. Yufeng Jin received his Ph.D. degree in Electronical Engineering in March 1999 from Southeast University, Nanjing, China. Since then, he has been working as a postdoctoral fellow, an associate professor and a professor in Institute o.

Seller Inventory # 595397888

Title
Jin, Y: Introduction to Microsystem Packaging Technology
Author
Yufeng Jin (Peking University)|Zhiping Wang|Jing Chen (Peking University)
Publisher
CRC Press
Publication year
2018
Condition
New
Binding
Kartoniert / Broschiert
Language
English
ISBN 10
1138374253
ISBN 13
9781138374256

moluna

Greven, Germany

5-star seller

AbeBooks seller since July 9, 2020

Shipping rates from Germany to U.S.A.

Item26 to 60 business days26 to 60 business days
First itemUS$ 56.83US$ 56.83
Delivery times are set by sellers and vary by carrier and location. Orders passing through Customs may face delays and buyers are responsible for any associated duties or fees. Sellers may contact you regarding additional charges to cover any increased costs to ship your items.

Payment methods

  • Visa
  • Mastercard
  • American Express
  • Apple Pay
  • Google Pay
  • Bank Wire Transfer
  • Check
  • Paypal

Store description

Online Handel nur mit Neubüchern

Seller's business information

Moluna GmbH

Engberdingdamm 27
Greven, Germany 48268