Joining of Silicon Carbide: Diffusion Bond Optimization and Characterization

Halbig, Michael C; Singh, Mrityunjay

ISBN 10: 128912244X / ISBN 13: 9781289122447

Published by Bibliogov, 2013

About this Item

Seller Inventory # I-9781289122447

Bibliographic Details

• Title: Joining of Silicon Carbide: Diffusion Bond Optimization and Characterization
• Publisher: Bibliogov
• Publication Date: 2013
• Language: English
• ISBN 10: 128912244X
• ISBN 13: 9781289122447
• Binding: Soft cover
• Condition: New

About this title

Synopsis

Joining and integration methods are critically needed as enabling technologies for the full utilization of advanced ceramic components in aerospace and aeronautics applications. One such application is a lean direct injector for a turbine engine to achieve low NOx emissions. In the application, several SiC substrates with different hole patterns to form fuel and combustion air channels are bonded to form the injector. Diffusion bonding is a joining approach that offers uniform bonds with high temperature capability, chemical stability, and high strength. Diffusion bonding was investigated with the aid of titanium foils and coatings as the interlayer between SiC substrates to aid bonding. The influence of such variables as interlayer type, interlayer thickness, substrate finish, and processing time were investigated. Optical microscopy, scanning electron microscopy, and electron microprobe analysis were used to characterize the bonds and to identify the reaction formed phases.