Laser Processing and Diagnostics: Proceedings of an International Conference, University of Linz, Austria, July 15-19, 1984

Dieter W. Bauerle

ISBN 10: 3540138439 / ISBN 13: 9783540138433

Published by Springer-Verlag Berlin and Heidelberg GmbH & Co. K, 1984

About this Item

Ancien livre de bibliothèque. Edition 1984. Tome 39. Ammareal reverse jusqu'à 15% du prix net de cet article à des organisations caritatives. ENGLISH DESCRIPTION Book Condition: Used, Very good. Former library book. Edition 1984. Volume 39. Ammareal gives back up to 15% of this item's net price to charity organizations.

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Bibliographic Details

• Title: Laser Processing and Diagnostics: Proceedings of an International Conference, University of Linz, Austria, July 15-19, 1984
• Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. K
• Publication Date: 1984
• Language: English
• ISBN 10: 3540138439
• ISBN 13: 9783540138433
• Binding: Hardcover
• Condition: Très bon

About this title

Synopsis

Laser processing is now a rapidly increasing field with many real and potential applications in different areas of technology such as micromecha nics, metallurgy, integrated optics, and semiconductor device fabrication. The neces s ity for such soph i st i cated 1 i ght sources as 1 asers is based on the spatial coherence and the monochromaticity of laser light. The spatial coherence permits extreme focussing of the laser light resulting in the availability of high energy densities which can be used for strongly loca lized heat- and chemical-treatment of materials, with a resolution down to 1 ess than 1 lJIll. When us i ng pul sed or scanned cw-l asers, 1 oca 1 i zat i on in time is also possible. Additionally, the monochromaticity of laser light allows for control of the depth of heat treatment and/or selective, nonthermal bond breaking - within the surface of the material or within the molecules of the surrounding reactive atmosphere - simply by tuning the laser wavelength. These inherent advantages of laser light permit micromachining of materials (drilling, cutting, welding etc. ) and also allow single-step controlled area processing of thin films and surfaces. Processes include structural transformation (removal of residual damage, grain growth in polycrystalline material, amorphization, surface hardening etc. ), etching, doping, alloying, or deposition. In addition, laser processing is not 1 imited to planar substrates."