Layer Formation and Thermal Performance | Gel Thermal Interfaces and Underfills - Basic Experimental and Modeling Techniques Applied to Contemporary Problems in Electronics Packaging
Drew Davidson
Sold by preigu, Osnabrück, Germany
AbeBooks Seller since August 5, 2024
New - Soft cover
Condition: New
Ships from Germany to U.S.A.
Quantity: 5 available
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