MEMS PACKAGING
Sold by Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
AbeBooks Seller since April 17, 2013
New - Hardcover
Condition: New
Ships within U.S.A.
Quantity: 2 available
Add to basketSold by Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
AbeBooks Seller since April 17, 2013
Condition: New
Quantity: 2 available
Add to basketThis is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Seller Inventory # ABBB-203318
Written as a collective work by 14 outstanding microsystems packaging specialists from US industries, government laboratories and universities, MEMS Packaging provides a comprehensive view of the prevalent practices and enabling techniques in the assembly, packaging and testing of MEMS and microsystems. The book also addresses aspects of microassembly and testing technologies that are often overlooked.
Aimed at professional engineers, scientists and technologists from industry, research laboratories and universities, the book examines every aspect of the assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in the key industries of life sciences, telecommunication and aerospace engineering. The authors cover key topics such as bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, RF telecommunications and aerospace applications.
Professor Tai-Ran Hsu received his PhD in mechanical engineering from McGill University, Canada. He worked extensively in the power plant equipment and nuclear industries before moving into academia. He is currently Professor and Director of Microsystems Design and Packaging Laboratory at San Jose State University, and has published over 120 technical papers and five books in FE, CAD and MEMS design, manufacture and packaging.
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