MEMS: A Practical Guide of Design, Analysis, and Applications

Oliver Paul

ISBN 10: 3540211179 / ISBN 13: 9783540211174

Published by Springer Berlin Heidelberg, Springer Berlin Heidelberg, 2006

About this Item

Druck auf Anfrage Neuware - Printed after ordering - MEMS are rapidly moving from the research laboratory to the mar ketplace. Many market studies indicate not only a tremendous market potential of MEMS devices; year by year we see the actual market grow as the technology matures. In fact, these days, many large silicon foundries have a MEMS group exploring this promising technology, including such giants as INTEL and Motorola. Yet MEMS are fundamentally different from microelectronics. This means that companies with an established track record in these branches need to adapt their skills, whereas companies that want to enter the 'miniaturization' market need to establish an entirely new set of capabil ities. The same can be said of engineers with classical training, who will also need to be educated toward their future professional activity in the MEMS field. Here are some questions that a company or technologist may ask: I have an existing product with miniaturization market poten tial. Which technology should I adopt What are the manufacturing options available for miniaturiza tion What are the qualitative differences How do we maintainamarketleadforproductsbased onMEMS Is there CAD support Can we outsource manufacturing Which skills in our current capability need only adaptation What skills need to be added Professors Jan Korvink and Oliver Paul have set out to answer these questions in a form that addresses the needs of companies, commercial practitioners, and technologists.

Seller Inventory # 9783540211174

Bibliographic Details

• Title: MEMS: A Practical Guide of Design, Analysis, and Applications
• Publisher: Springer Berlin Heidelberg, Springer Berlin Heidelberg
• Publication Date: 2006
• Language: English
• ISBN 10: 3540211179
• ISBN 13: 9783540211174
• Binding: Buch
• Condition: Neu
• Dimensions: 241W x 160H x 59D millimeters 241 millimeters width by 160 millimeters height by 59 millimeters depth
• Weight: 1630 grams

About this title

Synopsis

MEMS are rapidly moving from the research laboratory to the mar­ ketplace. Many market studies indicate not only a tremendous market potential of MEMS devices; year by year we see the actual market grow as the technology matures. In fact, these days, many large silicon foundries have a MEMS group exploring this promising technology, including such giants as INTEL and Motorola. Yet MEMS are fundamentally different from microelectronics. This means that companies with an established track record in these branches need to adapt their skills, whereas companies that want to enter the "miniaturization" market need to establish an entirely new set of capabil­ ities. The same can be said of engineers with classical training, who will also need to be educated toward their future professional activity in the MEMS field. Here are some questions that a company or technologist may ask: I have an existing product with miniaturization market poten­ tial. Which technology should I adopt? What are the manufacturing options available for miniaturiza­ tion? What are the qualitative differences? How do we maintainamarketleadforproductsbased onMEMS? Is there CAD support?Can we outsource manufacturing? Which skills in our current capability need only adaptation? What skills need to be added? Professors Jan Korvink and Oliver Paul have set out to answer these questions in a form that addresses the needs of companies, commercial practitioners, and technologists.

About the Author

Jan G. Korvink holds the Chair for Microsystem Technology, specializing in MEMS modeling and low cost MEMS fabrication, at IMTEK–The Institute for Microsystem Technology – University of Freiburg, Germany. Dr. Korvink has authored and co-authored more than 120 technical publications including 6 book chapters in the MEMS area and one book. He was a founder of the Swiss company NM Numerical Modeling. He serves on the technical program committees of the following international conferences: Nanotech, DTIP, ESSDERC, EUROSIME, Eurosensors.