Surveys three wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to development and manufacture, determines the criteria for packaging and integrating these devices into existing systems, and recommends research priorities. Num Pages: 136 pages. BIC Classification: TGMT1; TJFD5. Category: (P) Professional & Vocational. Dimension: 280 x 216. . . 1995. Paperback. . . . .

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Bibliographic Details

Title: Materials for High-Temperature Semiconductor Devices
Publisher: National Academies Press
Publication Date: 1995
Language: English
ISBN 10: 0309053358
ISBN 13: 9780309053358
Binding: Soft cover
Condition: New

About this title

Synopsis

Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities.

About the Author

Committee on Materials for High-Temperature Semiconductor Devices, Commission on Engineering and Technical Systems, National Research Council

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