Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics

Language: English

Published by Cambridge University Press, 2012

1107408717 / 9781107408715

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Seller: moluna, Greven, Germanymoluna

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Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconne.

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Title
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics
Author
Lin, Qinghuang
Publisher
Cambridge University Press
Publication year
2012
Condition
New
Binding
Soft cover
Language
English
ISBN 10
1107408717
ISBN 13
9781107408715

moluna

Greven, Germany

5-star seller

AbeBooks seller since July 9, 2020

Shipping rates from Germany to U.S.A.

Item16 to 45 business days16 to 45 business days
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