Mems Packaging: 5 (Wspc Series In Advanced Integration And Packaging)

MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.

This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.

Readership: Researchers and graduate students participating in research, R&D, and manufacturing of MEMS products; professionals associated with the integration for systems represented by smartphones, AR/VR, and wearable electronics.

Y C Lee is the S J Archuleta Professor at the Department of Mechanical Engineering, University of Colorado Boulder, USA. He is the Editor of the ASME Journal of Electronic Packaging. He is also the President and CEO of Kelvin Thermal Technologies, Inc. for the commercialization of flexible thermal ground planes. He was the Director of the DARPA Center on Nanoscale Science and Technology for Integrated Micro/Nano-Electromechanical Transducers (iMINT), USA from 2006 to 2012. Prior to joining the University in 1989, he was a Member of Technical Staff at AT&T Bell Laboratories, Murray Hill, New Jersey, USA. Dr Lee is recognized as a leader in packaging and interconnect technologies for microsystems integrating microelectronic, optoelectronic, microwave, microelectromechanical and nanoelectromechanical devices. He received the ASME InterPACK Achievement Award in 2013.

Yu-Ting Cheng received his MS degree in Materials Science and Engineering from Carnegie Mellon University in 1996 and the PhD degree in Electrical Engineering from the University of Michigan, Ann Arbor, in 2000. After graduation, he served at the IBM Thomas J Watson Research Center, Yorktown Heights, USA as a RSM. Currently, he is a Professor at the Department of Electronics Engineering at National Chiao Tung University, Taiwan. His research interests include Sensors and Actuators and Microsystem Integration. He has served as a TPC member in many international conferences including IEEE Transducers, Sensors, NEMS, ISMM, ISSNIP, and APCOT. He is a senior member of IEEE and a member of IOP, and Phi Tau Phi.

Ramesh Ramadoss received his Bachelor of Engineering degree from Thiagarajar College of Engineering, Madurai Kamaraj University, India, in May 1998, and his PhD degree in Electrical Engineering from the University of Colorado at Boulder, USA, in May 2003. From June 2003 to December 2007, he was employed as an Assistant Professor in the Department of Electrical and Computer Engineering at Auburn University, Auburn, AL, USA. From January 2008 to March 2012, he was employed as a Manager at FormFactor Inc., Livermore, CA. From April 2012 to May 2015, he was employed as a Senior Manager at Microprobe Inc. (Acquired by FormFactor Inc.), San Jose, CA. From June 2015 to February 2016, he was employed as a Technical Director at Applied Nanostructures Inc., Mountain View, CA. Since March 2016, he has been with FlexMEMS Inc., Newark, CA. He is the author or coauthor of 4 book chapters and 55 papers. He has conducted R&D projects for DARPA, NASA, US Army, US Air Force, Sandia National Labs, and Motorola Labs. In 2013, he was elevated to the grade of IEEE Senior Member. In 2014, he founded the IEEE San Francisco Bay Area MEMS & Sensors Chapter. In 2017, he was elected as the Chair of the IEEE Santa Clara Valley Section, the world's largest IEEE Section located in the heart of Silicon Valley.