Metallic Functional Materials | Development and Applications

ISBN 10: 3725869464 / ISBN 13: 9783725869466

Published by MDPI AG, 2026

About this Item

Metallic Functional Materials | Development and Applications | Buch | Englisch | 2026 | MDPI AG | EAN 9783725869466 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print on Demand.

Seller Inventory # 134966401

Bibliographic Details

• Title: Metallic Functional Materials | Development and Applications
• Publisher: MDPI AG
• Publication Date: 2026
• Language: English
• ISBN 10: 3725869464
• ISBN 13: 9783725869466
• Binding: Buch
• Condition: Neu
• Dimensions: 250W x 175H x 14D millimeters 250 millimeters width by 175 millimeters height by 14 millimeters depth
• Weight: 575 grams
• Seller catalogs:
  • Bücher

About this title

Synopsis

Metallic functional materials have become a strategic focus of contemporary research, bridging the gap between fundamental metallurgy and device-level innovation. This Reprint addresses the rising demand for intelligent, adaptive, and high-performance systems used in the energy conversion, aerospace, and biomedical sectors. It compiles cutting-edge research that explores how advanced processing routes, such as additive manufacturing and severe plastic deformation, interact with integrated computational approaches to stabilize novel phases.

This collection places a strong emphasis on shape memory alloys and Heusler alloys. Readers will find investigations into enhancing fatigue resistance in superelastic wires through nanocrystallization, as well as studies on the cyclic stability of single crystals. This Reprint also covers significant advancements in magnetic functional materials, including terahertz metamaterial absorbers and compounds exhibiting giant magnetic entropy changes for cryogenic refrigeration. Beyond magnetic and structural properties, the text expands into energy and electronic applications. Featured studies discuss the synthesis of composite hydrogen storage materials with improved kinetics and the development of conductive silver pastes for flexible electronics. In the biomedical domain, this Reprint explores methods to regulate the elastic modulus of orthopedic implants to prevent stress shielding.