Microchip Fabrication: A Practical Guide to Semiconductor Processing

Van Zant, Peter; Zant, Peter Van

ISBN 10: 0070672504 / ISBN 13: 9780070672505

Published by Redwood City, California, U.S.A.: Semiconductor Services, 1996

About this Item

hardback third edition in near fine condition.

Seller Inventory # 10044

Bibliographic Details

• Title: Microchip Fabrication: A Practical Guide to Semiconductor Processing
• Publisher: Redwood City, California, U.S.A.: Semiconductor Services
• Publication Date: 1996
• Language: English
• ISBN 10: 0070672504
• ISBN 13: 9780070672505
• Binding: Hardcover
• Edition: 3rd Edition
• Condition: Near Fine
• Seller catalogs:
  • computer science
  • Electronics
  • communication

About this title

Synopsis

Microchip Fabrication describes the issues, science, processes, and materials involved in manufacturing microchips. The scope covers the established older processes and those required for fabrication of state-of-the-art ULSI circuits. This, to my knowledge, is the only book in the field that explains this complicated technology to a non-technical reader in clear terms without resorting to equations and higher math. It is read as a first book by non-professionals and professionals coming into the field. Its purpose as a self study text is two fold. One-workers in chip plants and/or in supplier companies can understand the work they do and its relationship to the whole fabrication process. Two-the book will provide the basic understanding and terminology to make more advanced texts and professional articles meaningful. It is written for use as a textbook for introductory courses for both in-plant or community college level use.

From the Back Cover

A nontechnical, understandable guide to microchip fabrication, from semiconductor material preparation to the finished device This one-stop guide covers the entire process of microchip fabrication, from semiconductor material preparation to shipment of the finished and packaged device, using a plain-English, low-math approach that avoids complex engineering theory. The new Third Edition details all the current issues, science, processes and materials involved. It proceeds from basic materials and process chemicals to chip packaging procedures, with more than 500 drawings and figures to make the material crystal clear. The latest methods and data related to packaging, memory circuits, and semiconductor devices are presented in complete detail. The guide fully covers both established procedures and fabrication of state-of-the-art ULSI circuits. Plus, it covers vital supporting technologies such as crystal growth and contamination control of clean rooms. You'll find the latest material on such topics as photolithography processes for submicron images, chemical mechanical polishing (CMP) for planarization, and use of minienvironments for contamination control. For anyone involved in semiconductor operations, marketing, quality control, training, education, or technical services, this easy-to-use guide is basic equipment.