Microelectronic Interconnections and Assembly (NATO Science Partnership Sub-Series: 3:)
Language: English
Published by Springer, 1998
- Hardcover
- New
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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In English.
Seller Inventory # ria9780792351399_new
- Title
- Microelectronic Interconnections and Assembly (NATO Science Partnership Sub-Series: 3:)
- Publisher
- Springer
- Publication year
- 1998
- Condition
- New
- Binding
- Hardcover
- Language
- English
- ISBN 10
- 0792351398
- ISBN 13
- 9780792351399
- Item weight
- 718 grams
The basic issue is that the miniaturisation of electronic systems continues, and performance must continue to improve. The newest packages are often based on the selection of an appropriate interconnection method. Advances in chip-scale, chip-flip, and direct chip attachments are described. Although wire bonding currently dominates the market, the consensus is that flip chip interconnection will rapidly increase its market share. Tape automated bonding is also discussed, primarily for special applications. Solder metallurgy and flip chip production technology receive attention in several papers. Solderability, reliability and fatigue of the joints are modelled, and mechanical stresses resulting from temperature cycling are reported.
Multichip module and thick-film hybrid substrate interconnections are reported in several papers. These include thick and thin film metals, as well as low temperature polymer inks. Several papers describe diffusion and other metallurgical interactions in thick film surfaces.
"Synopsis" may belong to another edition of this title.
Ria Christie Collections
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