Microelectronics Failure Analysis Desk Reference

Language: English

Published by ASM International Dez 2019, 2019

162708245X / 9781627082457

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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Neuware - The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples.Topics include:Failure Analysis Process and Management-wafer, package, and board level failure analysis flow.Incoming Inspection Tools-optical, x-ray, and scanning acoustic microscopy.Fault Isolation-front and backside sample preparation, CAD navigation, laser-assisted device alteration (LADA), soft defect location (SDL), lock-in thermography, laser voltage probing (LVP), photon emission, EOTPR/TDR/TDT, and current imaging.Device and Circuit Characterization-scanning electron microscopy (SEM)-based and atomic force microscopy (AFM)-based nanoprobing.FIB Technique and Circuit Edit- FIB overview and advanced circuit edit for first silicon debug.Physical Analysis-deprocessing, cross section analysis, scanning electron microscopy, material analysis techniques, transmission electron microscopy (TEM), and scanning probe microscopy.Memory FA-DRAM, semiconductor memory failure signature analysis.Special Applications-automotive FA, 2.5 and 3D packaging failure analysis, microelectromechanical systems (MEMS), optoelectronics, solar, and counterfeit electronics.Fundamental Topics-integrated circuit testing, analog design, reliability, quality, and training.Seven new topics have been added and all themes covered in earlier editions are included in the Seventh Edition. Many previous articles have been updated.…

Seller Inventory # 9781627082457

Title
Microelectronics Failure Analysis Desk Reference
Author
Tejinder Gandhi
Publisher
ASM International Dez 2019
Publication year
2019
Condition
Neu
Binding
Buch
Language
English
ISBN 10
162708245X
ISBN 13
9781627082457
Item weight
1,805 grams
Dimensions
533x288x30 mm

AHA-BUCH GmbH

Einbeck, Germany

5-star seller

AbeBooks seller since August 14, 2006

Shipping rates from Germany to U.S.A.

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