Microelectronics Packaging Handbook
Language: English
Published by Chapman and Hall, 1997
- Hardcover
- New

Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
AbeBooks seller since February 27, 2001
Condition: New
US$ 238.65
Quantity: 15 available
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Seller Inventory # V9780412084515
- Title
- Microelectronics Packaging Handbook
- Author
- Tummala, R. R.; Rymaszewski, E.J.; Klopfenstein, Alan G.
- Publisher
- Chapman and Hall
- Publication year
- 1997
- Condition
- New
- Binding
- Hardcover
- Language
- English
- ISBN 10
- 0412084511
- ISBN 13
- 9780412084515
- Edition
- 2nd Edition
Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development.
Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail.
Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
"Synopsis" may belong to another edition of this title.
Review
IEEE Electrical Insulation Magazine, September/October 1997
"About the title" may belong to another edition of this title.
Kennys Bookshop and Art Galleries Ltd.
Galway, GY, Ireland
AbeBooks seller since February 27, 2001
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