Microelectronics Packaging Handbook, Vol.s 1-3: CD-ROM, Second Edition

R.R. Tummala/ Eugene J. Rymaszewski/ Alan G. Klopfenstein

ISBN 10: 0412085615 / ISBN 13: 9780412085611

Published by Springer, 1998

About this Item

2nd edition. 1000 pages. 7.00x7.25x1.00 inches. In Stock.

Seller Inventory # x-0412085615

Bibliographic Details

• Title: Microelectronics Packaging Handbook, Vol.s 1-3: CD-ROM, Second Edition
• Publisher: Springer
• Publication Date: 1998
• Language: English
• ISBN 10: 0412085615
• ISBN 13: 9780412085611
• Binding: CD-ROM
• Edition: 2nd Edition
• Condition: Brand New
• Weight: 0.34 kilograms

About this title

Synopsis

The Microelectronics Packaging Handbook continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing processes. Now available on CD-ROM for the first time, it discusses state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. The CD-ROM version includes a navigational scheme for easy access to content, hypertext links for glossary terms, references, footnotes and graphics, and full text search capabilities for more powerful querying of the information.

About the Authors

Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.

Rymaszewski is Research Professor in Materials Science & Engineering and Associate Director of the Center for Integrated Electronics at Rensselaer Polytechnic Institute.

Klopfenstein is President of AGK Enterprises in Hopewell Junction, New York.