A new collection of authoritative contributions on the state of the art of electrochemical deposition
Since the last edition of Modern Electroplating was published over a quarter century ago, electrochemical deposition has evolved into a mature science, with many new and potential applications. To address these developments, Modern Electroplating, Fourth Edition presents an entirely new collection of contributions on a wide range of cutting-edge topics, from electrodeposition of semiconductors to environmental considerations.
Geared to experienced deposition practitioners and novices alike, the new edition provides clear, thorough, up-to-date explanations of the principles and applications of highly relevant deposition techniques. It not only replaces the Third Edition, a very useful resource on electroplating processes, but, in addition, highlights the transition in the electronics industry from physical to electrochemical methods, especially with regard to next-generation technologies such as copper interconnect. Coverage includes:
* Electrodeposition of various metals and metal alloys
* Electrodeposition of semiconductors and electrodeposition on nonconductors
* Electrodeposition of conductive polymers
* Electroless deposition of various metals and alloys
* Preparation procedures for deposition
* Manufacturing technologies, monitoring, testing, and control
* Deposition and the environment

About the Author

MORDECHAY SCHLESINGER, PhD, is a professor in the Department of Physics at the University of Windsor, Ontario, Canada.

MILAN PAUNOVIC, PhD, is a researcher at IBM, T. J. Watson Research Center, Yorktown Heights, New York.

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