Paperback. Pub Date: 2015-12-01 Pages: 332 Language: Chinese Publisher: Electronic Industry Press With the development of electronic products to the multi-functional. high density. miniaturization direction of electronic linking process has undergone great changes. involving solder assembling material PCB. components and other more challenging. couplet technology and reliability of the higher requirements. therefore. an urgent need to elaborate a system of modern electronic instinct linking p.

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Bibliographic Details

Title: Modern electronics assembly technology(Chinese Edition)
Publisher: ???????
Publication Date: 2015
Language: Chinese
ISBN 10: 7121277298
ISBN 13: 9787121277290
Binding: paperback
Condition: New

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Language:Chinese.SoftCover.Pub Date:2015-12-01.publisher:Electronic Industry Press.description:Paperback. Pub Date: 2015-12-01 Pages: 332 Language: Chinese Publisher: Electronic Industry Press With the development of electronic products to the multi-functional. high density. miniaturization direction of electronic linking process has undergone

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