Moisture Sensitivity of Plastic Packages of IC Devices

E. Suhir

ISBN 10: 1461426251 / ISBN 13: 9781461426257

Published by Springer US, Springer US, 2012

About this Item

Druck auf Anfrage Neuware - Printed after ordering - Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

Seller Inventory # 9781461426257

Bibliographic Details

• Title: Moisture Sensitivity of Plastic Packages of IC Devices
• Publisher: Springer US, Springer US
• Publication Date: 2012
• Language: English
• ISBN 10: 1461426251
• ISBN 13: 9781461426257
• Binding: Taschenbuch
• Condition: Neu
• Dimensions: 235W x 155H x 32D millimeters 235 millimeters width by 155 millimeters height by 32 millimeters depth
• Weight: 879 grams

About this title

Synopsis

Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

From the Back Cover

Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: • Thorough exploration of moisture’s effects based on lectures and tutorials by the authors • Consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging • Emerging theories and cutting-edge industrial applications presented by the leading professionals in the field Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.