Multichip Modules With Integrated Sensors (Nato Science Partnership Subseries: 3 (Closed))

Jones, W.K.

ISBN 10: 9401066310 / ISBN 13: 9789401066310

Published by Springer, 2012

About this Item

reprint edition. 336 pages. 9.50x5.50x0.90 inches. In Stock.

Seller Inventory # x-9401066310

Bibliographic Details

• Title: Multichip Modules With Integrated Sensors (Nato Science Partnership Subseries: 3 (Closed))
• Publisher: Springer
• Publication Date: 2012
• Language: English
• ISBN 10: 9401066310
• ISBN 13: 9789401066310
• Binding: Paperback
• Condition: Brand New
• Weight: 0.55 kilograms

About this title

Synopsis

Advances in electronic devices with higher speeds and complexity have placed higher demands on the electronic packaging of systems. Multichip Modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capabilities have recently evolved to address these new requirements. Under the auspices of the NATO Science Committee an Advanced Research Workshop (ARW) on Multichip Modules with Integrated Sensors was hosted by the Technical University of Budapest, Budapest, Hungary, on May 18-20, 1995. Additionally, the Hungarian Chapter of ISHM-The Microelectronics Society held a poster session on this topic. This volume presents the majority of papers presented at the ARW and the ISHM-Hungary Session. The integration of sensors with high .performance MCM structures represent the trend for intelligent electronics. The book reviews advances in MCM technology, including ceramic based MCM-C, thin film MCM-D and organic laminate based MCM-L. Sensors based on micromachined silicon structures, thin, and thick film technology are reviewed. Applications of MCM to higher level integration and sensor integration and reliability impacts are presented. Developments in materials and processes for both MCM and sensors have lead to the enhanced performance of smart electronics. The work of the ARW, as demonstrated in the papers, addressed new materials development, characterized methods and high level integration of sensors into electronic packaging.