Language:Chinese.Paperback. Publisher: Electronic Industry Press. This book from the circuit design. material properties. process assembly. packaging. thermal design and test other aspects of comprehensive. Seller Inventory # D19252

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Bibliographic Details

Title: Multichip module technology handbook(Chinese...

Publisher: Electronic Industry Press

Publication Date: 1991

Binding: paperback

Condition: New

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NAN JING SHI JIANG NING QU NING YUAN DIAN ZI SHANG WU ZHONG XIN
Room 264, Oujiang Shopping Center, No. 1 Dongxin South Road, Dongshan Street, Jiangning District, NanJing, Nanjing, JS, 211100, China

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We guarantee the condition of every book as it's described on the Abebooks web sites. If you're dissatisfied with your purchase (Incorrect Book/Not as Described/Damaged) or if the order hasn't arrived, you're eligible for a refund within 30 days of the estimated delivery date. If you've changed your mind about a book that you've ordered, please use the Ask bookseller a question link to contact us and we'll respond within 2 business days. Please Note:We don't sell any international Edition to you...

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