Packaging and Embedded Electronics for the Next Generation
Language: English
Published by Bibliogov, 2013
- Softcover
- New
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
4-star seller
AbeBooks seller since January 19, 2007
Softcover
Condition: New
US$ 20.53
US$ 8.63 shipping
Ships from United Kingdom to U.S.A.
Quantity: 4 available
Add to basketFree 30-day returns
Item description from seller
Print on Demand pp. 24.
Seller Inventory # 393570182
- Title
- Packaging and Embedded Electronics for the Next Generation
- Author
- Sampson, Michael J
- Publisher
- Bibliogov
- Publication year
- 2013
- Condition
- New
- Binding
- Soft cover
- Language
- English
- ISBN 10
- 1289250561
- ISBN 13
- 9781289250560
This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.
"Synopsis" may belong to another edition of this title.
Majestic Books
Hounslow, United Kingdom
4-star seller
AbeBooks seller since January 19, 2007
Shipping rates from United Kingdom to U.S.A.
| Item | 14 to 45 business days | 5 to 10 business days |
|---|---|---|
| First item | US$ 8.63 | US$ 13.07 |
Payment methods
Store description
We specialise in General Interest Books from South Asian countries.
Specialty
Art, Economics, Buddhism, Religion, Sociology, PaintingSeller's business information
BOOKS AND PERIODICALS AGENCY LTD
Unit 4 Alice way,
Hounslow, United Kingdom TW3 3UD
Terms of sale
Returns accepted if you are not satisfied with the Service or Book.
Shipping terms
Best packaging and fast delivery