Packaging and Embedded Electronics for the Next Generation
Language: English
Published by Bibliogov, 2013
- Softcover
- New
Seller: Biblios, frankfurt am main, hessen, GermanyBiblios
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Softcover
Condition: New
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PRINT ON DEMAND pp. 24.
Seller Inventory # 18386062419
- Title
- Packaging and Embedded Electronics for the Next Generation
- Author
- Sampson, Michael J
- Publisher
- Bibliogov
- Publication year
- 2013
- Condition
- New
- Binding
- Soft cover
- Language
- English
- ISBN 10
- 1289250561
- ISBN 13
- 9781289250560
This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.
"Synopsis" may belong to another edition of this title.
Biblios
frankfurt am main, hessen, Germany
4-star seller
AbeBooks seller since September 10, 2024
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| Item | 25 to 45 business days | 8 to 14 business days |
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