Packaging of High Power Semiconductor Lasers (Micro- and Opto-Electronic Materials, Structures, and Systems)
Language: English
Published by Springer, 2016
- Softcover
- New
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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Softcover
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- Title
- Packaging of High Power Semiconductor Lasers (Micro- and Opto-Electronic Materials, Structures, and Systems)
- Author
- Liu, Xingsheng; Zhao, Wei; Xiong, Lingling; Liu, Hui
- Publisher
- Springer
- Publication year
- 2016
- Condition
- New
- Binding
- Soft cover
- Language
- English
- ISBN 10
- 149395590X
- ISBN 13
- 9781493955909
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
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About the Author
Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.
"About the title" may belong to another edition of this title.
Majestic Books
Hounslow, United Kingdom
4-star seller
AbeBooks seller since January 19, 2007
Shipping rates from United Kingdom to U.S.A.
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| First item | US$ 8.65 | US$ 13.11 |
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