Packaging of High Power Semiconductor Lasers (Micro- and Opto-Electronic Materials, Structures, and Systems)

Liu, Xingsheng, Zhao, Wei, Xiong, Lingling, Liu, Hui

ISBN 10: 149395590X / ISBN 13: 9781493955909

Published by Springer, 2016

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Bibliographic Details

• Title: Packaging of High Power Semiconductor Lasers (Micro- and Opto-Electronic Materials, Structures, and Systems)
• Publisher: Springer
• Publication Date: 2016
• Language: English
• ISBN 10: 149395590X
• ISBN 13: 9781493955909
• Binding: Paperback
• Condition: Like New
• Book Type: book

About this title

Synopsis

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

About the Author

Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.