Photovoltaic Module Technology

Harry Wirth

ISBN 10: 3110676974 / ISBN 13: 9783110676976

Published by De Gruyter, De Gruyter Apr 2025, 2025

About this Item

This item is printed on demand - it takes 3-4 days longer - Neuware -How to get the best out of solar cells, when aiming for efficiency, power, reliability, and cost After decades of R&D focus on the cell, recently the module has entered the stage and demonstrated huge innovation potential. Photovoltaic Module Technology provides unique insights into state-of-the-art materials, design strategies, manufacturing techniques, and characterization methods of wafer-based photovoltaic modules. Many properties of solar cells are highly relevant for module integration. They set the starting point for understanding the implications of different interconnection and encapsulation technologies. Module design and the choice of materials are described for both state-of-the-art and advanced module technology, with special attention attributed to the key processes of module assembly. 192 pp. Englisch.

Seller Inventory # 9783110676976

Bibliographic Details

• Title: Photovoltaic Module Technology
• Publisher: De Gruyter, De Gruyter Apr 2025
• Publication Date: 2025
• Language: English
• ISBN 10: 3110676974
• ISBN 13: 9783110676976
• Binding: Taschenbuch
• Edition: 2nd Edition
• Condition: Neu
• Dimensions: 240W x 170H x 13D millimeters 240 millimeters width by 170 millimeters height by 13 millimeters depth
• Weight: 376 grams

About this title

Synopsis

How to get the best out of solar cells, when aiming for efficiency, power, reliability, and cost? After decades of R&D focus on the cell, recently the module has entered the stage and demonstrated huge innovation potential.

Photovoltaic Module Technology provides unique insights into state-of-the-art materials, design strategies, manufacturing techniques, and characterization methods of wafer-based photovoltaic modules. Many properties of solar cells are highly relevant for module integration. They set the starting point for understanding the implications of different interconnection and encapsulation technologies. Module design and the choice of materials are described for both state-of-the-art and advanced module technology, with special attention attributed to the key processes of module assembly.

About the Author

Harry Wirth, Fraunhofer ISE, Freiburg, Germany.