Photovoltaic Module Technology
Language: English
Published by De Gruyter, DE, 2020
Series: Book 72 of 256 - De Gruyter STEM
- Softcover
- New

Seller: Rarewaves USA, HEBRON, KY, U.S.A.Rarewaves USA
AbeBooks seller since June 10, 2025
Condition: New
US$ 90.22
Quantity: Over 20 available
Add to basketItem description from seller
How to get the best out of solar cells, when aiming for efficiency, power, reliability, and cost? After decades of RandD focus on the cell, recently the module has entered the stage and demonstrated huge innovation potential. Photovoltaic Module Technology provides unique insights into state-of-the-art materials, design strategies, manufacturing techniques, and characterization methods of wafer-based photovoltaic modules. Many properties of solar cells are highly relevant for module integration. They set the starting point for understanding the implications of different interconnection and encapsulation technologies. Module design and the choice of materials are described for both state-of-the-art and advanced module technology, with special attention attributed to the key processes of module assembly.
Seller Inventory # LU-9783110676976
- Title
- Photovoltaic Module Technology
- Author
- Harry Wirth
- Publisher
- De Gruyter, DE
- Publication year
- 2020
- Condition
- New
- Binding
- Paperback
- Language
- English
- ISBN 10
- 3110676974
- ISBN 13
- 9783110676976
- Edition
- 2nd ed.
- Item weight
- 337 grams
- Series
- Book 72 of 256: De Gruyter STEM
How to get the best out of solar cells, when aiming for efficiency, power, reliability, and cost? After decades of R&D focus on the cell, recently the module has entered the stage and demonstrated huge innovation potential.
Photovoltaic Module Technology provides unique insights into state-of-the-art materials, design strategies, manufacturing techniques, and characterization methods of wafer-based photovoltaic modules. Many properties of solar cells are highly relevant for module integration. They set the starting point for understanding the implications of different interconnection and encapsulation technologies. Module design and the choice of materials are described for both state-of-the-art and advanced module technology, with special attention attributed to the key processes of module assembly.
"Synopsis" may belong to another edition of this title.
About the Author
Harry Wirth, Fraunhofer ISE, Freiburg, Germany.
"About the title" may belong to another edition of this title.
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