Planar Processing Primer

G. Anner

ISBN 10: 9401066825 / ISBN 13: 9789401066822

Published by Springer, Springer Okt 2011, 2011

About this Item

This item is printed on demand - it takes 3-4 days longer - Neuware -Planar Processing Primer is based on lecture notes for a silicon planar process ing lecture/lab course offered at the University of Illinois-UC for over fifteen years. Directed primarily to electrical engineering upperclassmen and graduate students, the material also has been used successfully by graduate students in physics and ceramic and metallurgical engineering. It is suitable for self-study by engineers trained in other disciplines who are beginning work in the semiconductor fields, and it can make circuit design engineers aware of the processing limitations under which they must work. The text describes and explains, at an introductory level, the principal processing steps used to convert raw silicon into a semiconductor device or integrated circuit. First-order models are used for theoretical treatments (e.g., of diffusion and ion implantation), with reference made to more advanced treatments, to computer programs such as SUPREM that include higher order effects, and to interactions among sequential processes. In Chapters 8, 9, and to, the application of silicon processes to compound semiconductors is discussed briefly. Over the past several years, the size of transistors has decreased markedly, allowing more transistors per chip unit area, and chip size has increased. 652 pp. Englisch.

Seller Inventory # 9789401066822

Bibliographic Details

• Title: Planar Processing Primer
• Publisher: Springer, Springer Okt 2011
• Publication Date: 2011
• Language: English
• ISBN 10: 9401066825
• ISBN 13: 9789401066822
• Binding: Taschenbuch
• Condition: Neu
• Dimensions: 229W x 152H x 35D millimeters 229 millimeters width by 152 millimeters height by 35 millimeters depth
• Weight: 929 grams

About this title

Synopsis

Planar Processing Primer is based on lecture notes for a silicon planar process­ ing lecture/lab course offered at the University of Illinois-UC for over fifteen years. Directed primarily to electrical engineering upperclassmen and graduate students, the material also has been used successfully by graduate students in physics and ceramic and metallurgical engineering. It is suitable for self-study by engineers trained in other disciplines who are beginning work in the semiconductor fields, and it can make circuit design engineers aware of the processing limitations under which they must work. The text describes and explains, at an introductory level, the principal processing steps used to convert raw silicon into a semiconductor device or integrated circuit. First-order models are used for theoretical treatments (e.g., of diffusion and ion implantation), with reference made to more advanced treatments, to computer programs such as SUPREM that include higher order effects, and to interactions among sequential processes. In Chapters 8, 9, and to, the application of silicon processes to compound semiconductors is discussed briefly. Over the past several years, the size of transistors has decreased markedly, allowing more transistors per chip unit area, and chip size has increased.