Polymer Surface Modification, Vol. 3

This book documents the proceedings of the Fourth International Symposium on Polymer Surface Modification: Relevance to Adhesion held under the auspices of MST Conferences, LLC in Orlando, FL, June 9-11, 2003.
Polymers are used for a variety of purposes in a host of technological applications and even a cursory look at the literature will evince that currently there is tremendous interest and R&D activity in the area of polymer surface modification to attain their desired surface characteristics, particularly to enhance their adhesion.
This volume contains a total of 25 papers which were properly peer reviewed, revised and edited. So this book is not merely a collection of papers, rather represents the highest standard of publication. The book is divided into three parts: 1. Plasma Surface Modification Techniques; 2. Other / Miscellaneous Surface Modification Techniques; and 3. General Papers. The topics covered include: low pressure plasma surface modification of a variety of polymers using various gases; atmospheric pressure plasma treatment; improvement of stain release properties of fabrics; modification of electrostatic properties of polymers; photon-based processes for surface modification of fibers; excimer UV light treatment; excimer laser surface treatment; low-energy ion treatment; photo-grafting and photo-curing; metallization of treated polymers; chemical (wet) functionalization of polymers; adhesion of paints to thermoplastic substrates; polymer release surfaces; nanolithography in polymer films; gas barrier properties of ceramic layers on polymers; and modification of interphase layer and relevance to adhesion.
This volume and its predecessors containing plentiful information should serve as a comprehensive source of latest R&D activity in the highly technologically important arena of polymer surface modification. Anyone interested –centrally or peripherally– in knowing or learning about the various ways to modify polymer surfaces should find this book of immense value.