Language:Chinese.Paperback. Pub Date: 2022-08-01 Publisher: Mechanical Industry Press This book mainly expounds the development history of power semiconductor device packaging technology and the basic principles and methods involved in materials. processes. quality control and product certification. At the same time. the electrical performance test. failure analysis. product design. simulation stress analysis and power module packaging technology of power semiconductor devices are systematica.

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Bibliographic Details

Title: Power semiconductor device packaging technology(Chinese Edition)
Publisher: Mechanical Industry Press
Publication Date: 2022
Language: Chinese
ISBN 10: 7111707540
ISBN 13: 9787111707547
Binding: paperback
Condition: New

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Language:Chinese.paperback.Pub Date:2022-08-01.publisher:Mechanical Industry Press.description:Paperback. Pub Date: 2022-08-01 Publisher: Mechanical Industry Press This book mainly expounds the development history of power semiconductor device packaging technology and the basic principles and methods involved in materials. processes. quality c

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