Proceedings of the 7th International Conference on Materials Engineering and Nanotechnology 2023 (ICMEN 2023); 04-05 Nov, Kuala Lumpur, Malaysia
Language: English
Published by Springer Verlag, Singapore, SG, 2024
- Hardcover
- New

Seller: Rarewaves.com UK, London, United KingdomRarewaves.com UK
AbeBooks seller since June 11, 2025
Condition: New
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Add to basketItem description from seller
This book includes selected peer reviewed articles presented at the 7th International Conference on Materials Engineering and Nanotechnology 2023 (ICMEN 2023) held on 04-05Nov at Kuala Lumpur in Malaysia. It highlights recent innovative approach and developments in materials engineering and nanotechnology fields. A broad range of topics and issues in modern materials science and nanotechnology are discussed, including advanced materials synthesis and characterization, nanoscale science and engineering, functional composite and nanomaterials, sustainable materials and green technologies. The importance and relevance of these proceedings lie in their contribution to the scientific community's collective knowledge and understanding of materials science/engineering and nanotechnology. By disseminating cutting-edge research findings and innovations, these proceedings foster collaboration, inspire new ideas, and push the boundaries of scientific discovery. Given its scope, this book will be of interest to a wide readership, including materials and nanotechnology engineers, scholars and researchers in science, technology and engineering disciplines.…
Seller Inventory # LU-9789819740796
- Title
- Proceedings of the 7th International Conference on Materials Engineering and Nanotechnology 2023 (ICMEN 2023); 04-05 Nov, Kuala Lumpur, Malaysia
- Author
- Chee, Ching Yern
- Publisher
- Springer Verlag, Singapore, SG
- Publication year
- 2024
- Condition
- New
- Binding
- Hardback
- Language
- English
- ISBN 10
- 9819740797
- ISBN 13
- 9789819740796
- Edition
- 2024 ed.
This book includes selected peer reviewed articles presented at the 7th International Conference on Materials Engineering and Nanotechnology 2023 (ICMEN 2023) held on 04-05Nov at Kuala Lumpur in Malaysia. It highlights recent innovative approach and developments in materials engineering and nanotechnology fields. A broad range of topics and issues in modern materials science and nanotechnology are discussed, including advanced materials synthesis and characterization, nanoscale science and engineering, functional composite and nanomaterials, sustainable materials and green technologies. The importance and relevance of these proceedings lie in their contribution to the scientific community's collective knowledge and understanding of materials science/engineering and nanotechnology. By disseminating cutting-edge research findings and innovations, these proceedings foster collaboration, inspire new ideas, and push the boundaries of scientific discovery. Given its scope, this book will be of interest to a wide readership, including materials and nanotechnology engineers, scholars and researchers in science, technology and engineering disciplines.
"Synopsis" may belong to another edition of this title.
About the Author
Dr. Ching Yern Chee earned her PhD in Materials Engineering from the University of Malaya. Her research primarily centers on polymer composites, nanomaterials and bionanocomposite. Dr. Ching specializes in gaining a deep understanding of biobased nanomaterials and composites, focusing on their processing development and elucidating the intricate relationship between processing techniques, material structure, and resulting properties.
Dr. Cong Wang is a Prof. in the Dept. of Physics, Beihang University, China. His research interests are in the fields of condensed matter physics and solar energy physics, including structure, magnetic and electronic transport of antiperovskite structured Mn3XN(C) materials solar selective absorbing/emitting/transmitting coatings and surface for solar thermal power, radiation cooling, photoelectron sensor.
"About the title" may belong to another edition of this title.
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