Process Modeling of Chemical Mechanical Planarization : An Integrated Model from Abrasive Scale to Chip Scale; Basics, Characterizations, Modeling and Verification

Jihong Choi

ISBN 10: 3639001664 / ISBN 13: 9783639001662

Published by VDM Verlag Dr. Müller, VDM Verlag Dr. Müller E.K., 2008

About this Item

Neuware - Chemical Mechanical Planarization (CMP) is one of the key enabling technologies for modern IC fabrication. However, mainly due to the high complexities coming from various interactions among mechanical reactions and chemical reactions, its fundamental working mechanism is still not fully understood. This book summarizes key CMP applications and challenges in modern IC fabrication, and provides a comprehensive physical CMP process model that can be applied for process characterization, process optimization, consumable development, and layout design for manufacturing (DFM). The model has been built from an abrasive scale to a chip scale, focusing on practical application for DFM while also considering CMP process conditions as key input parameters. Also included are examples of a computer model application for pattern dependent variation in shallow trench isolation CMP and the model verification with specially designed test chip. The model should help CMP professionals, DFM engineers and students of IC fabrication obtain a fundamental understanding of CMP process and characterize and improve a process through real application.

Seller Inventory # 9783639001662

Bibliographic Details

• Title: Process Modeling of Chemical Mechanical Planarization : An Integrated Model from Abrasive Scale to Chip Scale; Basics, Characterizations, Modeling and Verification
• Publisher: VDM Verlag Dr. Müller, VDM Verlag Dr. Müller E.K.
• Publication Date: 2008
• Language: English
• ISBN 10: 3639001664
• ISBN 13: 9783639001662
• Binding: Taschenbuch
• Condition: Neu
• Dimensions: 220W x 150H x 9D millimeters 220 millimeters width by 150 millimeters height by 9 millimeters depth
• Weight: 233 grams

About this title

Synopsis

Chemical Mechanical Planarization (CMP) is one of the key enabling technologies for modern IC fabrication. However, mainly due to the high complexities coming from various interactions among mechanical reactions and chemical reactions, its fundamental working mechanism is still not fully understood. This book summarizes key CMP applications and challenges in modern IC fabrication, and provides a comprehensive physical CMP process model that can be applied for process characterization, process optimization, consumable development, and layout design for manufacturing (DFM). The model has been built from an abrasive scale to a chip scale, focusing on practical application for DFM while also considering CMP process conditions as key input parameters. Also included are examples of a computer model application for pattern dependent variation in shallow trench isolation CMP and the model verification with specially designed test chip. The model should help CMP professionals, DFM engineers and students of IC fabrication obtain a fundamental understanding of CMP process and characterize and improve a process through real application.

About the Author

Ph.D.: studied semiconductor & MEMS processing with focus on CMP modeling at UC Berkeley. Senior process development engineer at Advanced Micro Devices,Inc., AMD-IBM Alliance, East Fishkill, New York