RF and Microwave Microelectronics Packaging II

Language: English

Published by Springer International Publishing, 2018

3319847198 / 9783319847191

  • Softcover
  • New
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Seller: moluna, Greven, Germanymoluna

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Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Ken Kuang is President of Torrey Hills Technologies, LLC, a leader in the supply of quality microelectronics packaging components. From 2004-2013, Kuang led Torrey Hills to rank #188 in INC500 Fast Growing Private Companies in America and rank #2 in Sa.

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Title
RF and Microwave Microelectronics Packaging II
Author
Kuang, Ken|Sturdivant, Rick
Publisher
Springer International Publishing
Publication year
2018
Condition
New
Binding
Soft cover
Language
English
ISBN 10
3319847198
ISBN 13
9783319847191
Seller catalogs
Mathematik/Naturwissenschaften/Technik/Medizin

moluna

Greven, Germany

5-star seller

AbeBooks seller since July 9, 2020

Shipping rates from Germany to U.S.A.

Item16 to 45 business days16 to 45 business days
First itemUS$ 56.89US$ 56.89
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Moluna GmbH

Engberdingdamm 27
Greven, Germany 48268