RF and Microwave Microelectronics Packaging II

Language: English

Published by Springer International Publishing, Springer Nature Switzerland Mär 2017, 2017

3319516965 / 9783319516967

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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. 188 pp. Englisch.

Seller Inventory # 9783319516967

Title
RF and Microwave Microelectronics Packaging II
Author
Rick Sturdivant
Publisher
Springer International Publishing, Springer Nature Switzerland Mär 2017
Publication year
2017
Condition
Neu
Binding
Buch
Language
English
ISBN 10
3319516965
ISBN 13
9783319516967
Item weight
453 grams
Dimensions
241x160x16 mm

BuchWeltWeit Ludwig Meier e.K.

Bergisch Gladbach, Germany

5-star seller

AbeBooks seller since January 11, 2012

Shipping rates from Germany to U.S.A.

Item5 to 15 business days5 to 15 business days
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BuchWeltWeit Ludwig Meier e.K.

Germany