RF and Microwave Microelectronics Packaging II

Language: English

Published by Springer International Publishing, Springer Nature Switzerland Jun 2018, 2018

3319847198 / 9783319847191

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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. 188 pp. Englisch.

Seller Inventory # 9783319847191

Title
RF and Microwave Microelectronics Packaging II
Author
Rick Sturdivant
Publisher
Springer International Publishing, Springer Nature Switzerland Jun 2018
Publication year
2018
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
3319847198
ISBN 13
9783319847191
Item weight
295 grams
Dimensions
235x155x11 mm

BuchWeltWeit Ludwig Meier e.K.

Bergisch Gladbach, Germany

5-star seller

AbeBooks seller since January 11, 2012

Shipping rates from Germany to U.S.A.

Item5 to 15 business days5 to 15 business days
First itemUS$ 26.71US$ 26.71
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BuchWeltWeit Ludwig Meier e.K.

Germany